X Cut single crystal quartz

Quartz X-cut, 4" dia x 0.5mm Thickness, 1 sp

Quartz X-cut, 4" dia x 0.5mm Thickness, 1 sp

기본 정보
Product Name Quartz X-cut, 4" dia x 0.5mm Thickness, 1 sp
Sale Price Call for Price
Product Code SOX50D05C1
Quantity 수량증가수량감소
Stock 1n Stock
상품 옵션
 
  •  Single crystal SiO2 (quartz)
  • Size
  • 4" diameter x 0.5 mm
  • Orientation
  • X-cut
  • Polish
  • one sides polished.
  • Surface roughness
  • < 5 A ( by AFM)
  • Packing
  • in 1000 class clean room by wafer carrier
  • Single crystal quartz wafer is an excellent substrate for microwave filters for wireless communication industries.  MTI can provide high quality quartz wafers for both research and industries production at the lowest price.
  •  Typical Physical Properties
  • Purity Wt %
  • SAW grade: > 99.9
    Optical grade: 99.99
  • Crystal Structure
  • Hex. a = 4.914 Å c = 5.405 Å
  • Growth Method
  • Hydrothermal
  • Hardness
  • 7.0 Moh’s
  • Density
  • 2.684 g/cm3
  • Melt Point
  • 1610 oC ( phase transition point: 573.1 oC )
  • Specific heat
  • 0.18 cal/gm
  • Thermoelectric Constant
  • 1200 mV /oC @ 300 oC
  • Thermal conductivity
  • 0.0033 cal/cm/ oC
  • Thermal expansion (x10-6/ oC)
  • a11: 13.71
    a33: 7.48
  • Index of Refraction
  • 1.544
  • Q value
    Acoustic velocity, SAW
    Frequency constant, BAW
    Piezoelectric coupling ,
  • 1.8 x 106 min.
    3160 ( m/sec )
    1661 ( kHz/mm )
    K2 (%) BAW: 0.65 SAW: 0.14
  • Inclusion
  • IEC Grade II
  •  Standard Quartz Wafer Specifications
  • Orientation
  • Y, X or Z cut: Rotated to any value in the range 30o ~ 42.75o ± 5 min.
    Primary flat: orientation specified by customer ± 30 min
    Secondary Flat: orientation specified by customer.
    Seed: located in the center: width < 5mm, height > 66mm
  • Polished surface
  • EPI polished on one side or two sides to Ra < 10 Å
    Working Area: Wafer diameter minus 3 mm
    BOW: < 20 mm for 3” wafer and 30 mm for 4” wafer
    No chips out on working area. In the edge, chip width < 0.5 mm
    Pit and scratches: < 3 per wafer or < 20 per 100 wafers
  • Standard Thickness
  • 0.5 mm ± 0.05mm
    TTV < 5 mm
  • Standard Diameter
  • f 2” (50.8mm )  f 3” (76.2mm)  f 4” (100mm)  ±0.2 mm
    Primary Flat : 22 ± 1.5 mm (f 3” )  32 ± 3.0 mm ( f 4” )
    Secondary Flat: 10 mm ±1.5 mm
  • Production Capability
  • 20,000 wafer per month
  •  Special size and orientation are available upon request