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GaP Substrates (111)
GaP Wafer, Undoped (111) 3"x0.45 mm, 1sp
- Size
- 3" diameter x 0.45 mm
- carrier concentration
- 6.6x10^16 cm-3
- Polished
- one side polished
- Surface finish (RMS or Ra)
- < 8A
- Typical Physical Properties
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Crystal Structure |
Cubic. a = 5.4505 Å |
Growth Method |
CZ (LEC) |
Density |
4.13 g/cm3 |
Melt Point |
1480 oC |
Thermal Expansion |
5.3 x 10-6 / oC |
Dopant |
S doped |
undoped |
Crystal growth axis |
<111> or <100> |
<100> or <111> |
Conducting Type |
N |
N |
Carrier Concentration |
2 ~ 8 x 1017 /cm3 |
4 ~ 6 x 1016 /cm3 |
Resistivity |
~ 0.03 ohm-cm |
~ 0.3 ohm-cm |
EPD |
< 3 x 105 |
< 3 x 105 |
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