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Special Orientation LaAlO3 Substrate
LaAlO3, (110) 5x5x0.5 mm substrate, one side Epi polished
- Wafer Size
- 5x5 x 0.5 mm thickness +/-0.05 mm,
- Wafer Orientation
- (110) +/-0.5 Deg
- Polishing
- One side CMP polished with free sub-surface damaged.
- Surface finish (RMS or Ra)
- < 10A
- Packed
- Under 1000 class clean room, and in 100 grade plastic bag in a wafer container.
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