PCE-80 is larger plasma cleaner with 8.5"dia x 12"L quartz chamber and 0 - 100W variable RF power.. It is designed to clean and remove nano-scale organic contamination on substrate or wafer up to 8" using air, oxygen, or argon plasma. The rate of organic removal is about 20 nm/min Max. at high RF power. It is excellent tool to pre-clean single crystal substrate before epitaxial film deposition to achieve the better quality. If you don't have experience for plasma surface cleaning, please refer to the articles as the follows :
•McIntire, Theresa M., S. Rachelle Smalley, John T. Newberg, A. Scott Lea, John C. Hemminger, Barbara J. Finlayson-Pitts. "Substrate Changes Associated with the Chemistry of Self-Assembled Monolayers on Silicon." Langmuir (2006) 22(13): 5617-5624.
•Sumner, Ann Louise, Erik J. Menke, Yael Dubowski, John T. Newberg, Reginald M. Penner, John C. Hemminger, Lisa M. Wingen, Theo Brauers, Barbara J. Finlayson-Pitts. "The Nature of Water on Surfaces of Laboratory Systems and Implications for Heterogeneous Chemistry in the Troposphere." Phys. Chem. Chem. Phys. (2004) 6: 604-613.
•Mennicke, Ulrike, Tim Salditt. "Preparation of Solid-Supported Lipid Bilayers by Spin-Coating." Langmuir (2002) 18: 8172-8177.
