Plastic Foam Module Wafer Carrier is a solution for valued and fragile devices. This packing is designed to protect delicate parts during transport, processing, inspection and assembly. Also it has been applied largely in many fields like optical materials, opto-electonic components, semiconductor, and optical communication. The structure consists of three cushions, the middle cushion called module cushion can be customized to specific shape to hold the devices exactly and safely.
Specifications
TYPE
SP4-12012T/BK
Inside Dimension
4 " diameter
Outside Dimension
120 mm x 120 mm x 12 mm
Color
Cover : Transparent / Body : blac.
Module Structure in box
double 4" diameter foam insert modules are included and suitable for packing single wafer