Au/Cr coated SiO2/Si substrate ,4" x 0.525 mm,1sp P-type B-doped, •Au(111) = 150 nm th with grain size : ~ 50 nm at Room Temperature •Cr = 2 nm •SiO2 = 300 nm •Si(100) P type B doped ~ 525 um Prime Grade
Resistivity
< 0.005 ohm.cm
Substrate Size
4" diameter +/- 0.5 mm x 0.5 mm
Polish
one side polished
Surface roughness
< 10 A RMS
Maximum Thermal Budget of Au film
~ 200 degree C
Optional : you may need tool below to handle the wafer
